Features
Compatible products:Other products that can be used with this product.
HPE Compute Mainstream Platforms, see QuickSpecs for more information
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
Buffered memory type:
Registered (buffered)
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2933 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
21
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory data transfer rate:
2933 MT/s
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 64 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
64 GB
Logistics data
Harmonized System (HS) code:
84733020
Other features
Weight (imperial):
0.0454 kg (0.1 lbs)
Height (imperial):
1.91 cm (0.75")
Packaging data
Package weight:Weight of the packaged product.
45 g
Package height:The distance from the top to the bottom of the packaging.
88.9 mm
Package depth:The distance from the front to the back of the packaging.
19.1 mm
Package width:The distance from one side of the packaging to the other.
190.5 mm
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
19.1 mm
Depth:The distance from the front to the back of something.
190.5 mm
Width:The measurement or extent of something from side to side.
88.9 mm
