Design
Base plate material:
Copper
Material:The material from which a thing is or can be made e.g. wood, plastic.
Aluminium, Copper
General
Type:Characteristics of the device.
Computer Cooling Systems
Logistics data
Harmonized System (HS) code:
84733080
Packaging content
Performance
Quantity per pack:The amount in each pack.
1 pc(s)
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
AMD A, AMD Athlon, AMD Ryzen™ 3, AMD Ryzen™ 5, AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 9, Intel® Celeron®, Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™ i9, Intel® Pentium®
Supported processor sockets:The sockets (plugs) for processors that are supported (can be used) by the device.
Intel LGA1851, LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1700, Socket AM4, Socket AM5
Fan diameter:The size of the fan, measured by the distance from one side of the fan to the other, via a straight line going through the middle of the fan.
Type:Characteristics of the device.
Heatsink/Radiator
Suitable location:
Processor
Weight & dimensions
Package weight:Weight of the packaged product.
1.97 kg
Package height:The distance from the top to the bottom of the packaging.
224 mm
Package depth:The distance from the front to the back of the packaging.
194 mm
Package width:The distance from one side of the packaging to the other.
194 mm
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
1.18 kg
Height:The measurement of the product from head to foot or from base to top.
152 mm
Depth:The distance from the front to the back of something.
154 mm
Width:The measurement or extent of something from side to side.
158 mm