Features
Backlight:Product has a built-in light source for its illuminating.
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
AMD Extended Profiles for Overclocking (EXPO):
Intel Extreme Memory Profile (XMP) version:
3.0
Intel Extreme Memory Profile (XMP):
Module configuration:
2048M x 64
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
6000 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
30
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC
Memory data transfer rate:
6000 MT/s
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR5
Memory layout (modules x size):
2 x 32 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
64 GB
Buffered memory type:
Unregistered (unbuffered)
Packaging data
Package weight:Weight of the packaged product.
169 g
Package height:The distance from the top to the bottom of the packaging.
13 mm
Package depth:The distance from the front to the back of the packaging.
155 mm
Package width:The distance from one side of the packaging to the other.
139 mm
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
44 mm
Depth:The distance from the front to the back of something.
8 mm
Width:The measurement or extent of something from side to side.
133.3 mm
