Quick Code: Q MPN: HX426C16FB3/8
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Overview


Unleash your style. Unleash your FURY.

HyperX® FURY DDR4 provides a powerful performance boost for gaming, video editing, and rendering with speeds up to 3733MHz. This cost-effective upgrade is available in 2400MHz–3733MHz speeds, CL15–19 latencies, single module capacities of 4GB–32GB, and kit capacities of 16GB–128GB. It features Plug N Play* automatic overclocking at 2400MHz and 2666MHz speeds and is both Intel XMP-ready and Ready for AMD Ryzen. HyperX FURY DDR4 stays cool with its stylish, low-profile heat spreader. 100% tested at speed and backed by a lifetime warranty, it’s an easy, worry-free upgrade for your Intel or AMD-based system.

- Updated low-profile heat spreader design
- Cost-efficient, high-performance DDR4 upgrade
- Intel XMP-ready
- Ready for AMD Ryzen
- Speeds up to 3733MHz and kit capacity up to 128GB
- Plug N Play functionality at 2400MHz and 2666MHz*

* HyperX Plug N Play memory will run in DDR4 systems up to the speed allowed by the manufacturer’s system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer’s BIOS. HyperX Plug N Play DDR4 products support XMP 2.0 specifications so overclocking can also be achieved by enabling the built-in XMP Profile.




Specification

Technical Description:

Features
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Country of origin:Country where the device is made.
China
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
16
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
Laptop
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2666 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB

Logistics data
Products per master (outer) case:
25 pc(s)
Master (outer) case gross weight:
1.43 kg
Harmonized System (HS) code:
84733020
Master (outer) case height:
60.9 mm
Master (outer) case length:
311.1 mm
Master (outer) case width:
196.8 mm

Operational conditions
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C

Packaging data
Package weight:Weight of the packaged product.
51.5 g
Package height:The distance from the top to the bottom of the packaging.
171.4 mm
Package depth:The distance from the front to the back of the packaging.
57.1 mm
Package width:The distance from one side of the packaging to the other.
13.9 mm

Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
36 g
Height:The measurement of the product from head to foot or from base to top.
34.1 mm
Depth:The distance from the front to the back of something.
133.3 mm
Width:The measurement or extent of something from side to side.
7.2 mm

Product details

HX426C16FB3/8 Kingston

£0.00 and

SKU: HX426C16FB3/8