Main product

Overview


Sleek Design
For the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5's unique features, delivering a sleek OC gaming memory that packs a powerful performance.

Reinforced Structure
The VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.

Better Cooling
TEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.

Supports Intel XMP3.0 for One-Click Overclocking
Supports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.

Strengthened PMIC Cooling Design
The VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.

Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
The VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.

On-die ECC for Stable System
The VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.

High-Quality ICs Selected for Stability & Reliability
TEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.




At-a-glance


  • High-Quality ICs Selected for Stability & Reliability

  • On-die ECC for Stable Systems

  • Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage

  • Reinforced Structure for Better Cooling

  • Sleek Design

  • Strengthened PMIC Cooling Design

  • Supports Intel XMP3.0 for One-Click Overclocking




Reasons to buy

  • High-Quality ICs Selected for Stability & Reliability
  • On-die ECC for Stable Systems
  • Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
  • Reinforced Structure for Better Cooling
  • Sleek Design
  • Strengthened PMIC Cooling Design
  • Supports Intel XMP3.0 for One-Click Overclocking

Specification

Technical Description: Team Group DDR5 Memory RAM - 32GB
Features
Compatible products:Other products that can be used with this product.
Intel Z690, Intel B660
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Intel Extreme Memory Profile (XMP) version:
3.0
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
5600 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
32
On-Die ECC:
Yes
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR5
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Buffered memory type:
Unregistered (unbuffered)

Packaging data
Package type:The type of product package e.g. box.
Box

Sustainability
Sustainability compliance:
Yes

Technical details
Compliance certificates:
RoHS

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
32.7 mm
Depth:The distance from the front to the back of something.
140 mm
Width:The measurement or extent of something from side to side.
7.5 mm

Product details

FLBD532G5600HC32DC01 Team Group 0765441661486

Team Group DDR5 Memory RAM - 32GB

£74.99 and

SKU: FLBD532G5600HC32DC01

Team Group DDR5 Memory RAM - 32GB

Quick Code: Q3126139 MPN: FLBD532G5600HC32DC01
£74.99

Out of Stock

Key Features

  • Sleek Design
  • Reinforced Structure for Better Cooling
  • Supports Intel XMP3.0 for One-Click Overclocking
  • Strengthened PMIC Cooling Design
  • On-die ECC for Stable Systems