Features
Commodity Classification Automated Tracking System (CCATS):
G077159
Export Control Classification Number (ECCN):
5A992C
CPU configuration (max):
1
Embedded options available:
PCI Express CEM revision:
3.0
Thermal solution specification:
PCG 2017X
Supported instruction sets:
SSE4.1, SSE4.2, AVX 2.0, AVX-512
PCI Express slots version:
3.0
Maximum number of PCI Express lanes:
44
Graphics
Discrete graphics card model:
Not available
On-board graphics card model:
Not available
Logistics data
Harmonized System (HS) code:
8542310001
Memory
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels:
Quad-channel
Memory clock speeds supported by processor:
2666 MHz
Memory types supported by processor:
DDR4-SDRAM
Maximum internal memory supported by processor:
128 GB
Operational conditions
Other features
Maximum internal memory:The maximum internal memory which is available in the product.
128 GB
Maximum internal memory:The maximum amount of memory inside a product, usually measured in bytes e.g megabytes (MB) or gigabytes (GB).
131072 MB
Packaging data
Package type:The type of product package e.g. box.
Retail box
Processor
Generation:
9th Generation
Processor codename:
Skylake
Memory bandwidth supported by processor (max):
85 GB/s
Thermal Design Power (TDP):
165 W
Processor cache type:
Smart Cache
Processor boost frequency:The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
4.4 GHz
Processor operating modes:Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.
64-bit
System bus rate:A bus is a communication system that transfers data between components inside a computer, or between computers. The system bus rate is the speed at which data is transferred in this communication system.
8 GT/s
Processor series:
Intel® Core™ X-series
Component for:What this product is used as a part of (component for).
PC
Box:Plastic or metal shell/container for components.
Processor lithography:The process which is performed by the processor e.g. CPU (Central Processing Unit).
14 nm
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 2066 (Socket R4)
Processor cores:The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).
10
Processor base frequency:
3.5 GHz
Processor model:The model number for the processor in a computer.
i9-9900X
Processor generation:
9th gen Intel® Core™ i9
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
Intel® Core™ i9 X-series
Processor manufacturer:The manufacturer that produced the processor.
Intel
Processor special features
AVX-512 Fused Multiply-Add (FMA) units:
2
Intel Turbo Boost Max Technology 3.0:
Intel Virtualization Technology (VT-x):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel Virtualization Technology for Directed I/O (VT-d):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel® Optane™ Memory Ready:
Intel® Turbo Boost Max Technology 3.0 frequency:
4.5 GHz
Enhanced Intel SpeedStep Technology:
Intel® AES New Instructions (Intel® AES-NI):Added Security with Faster Data Encryption\nThe Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
Intel® Hyper Threading Technology (Intel® HT Technology):Improved Performance for Threaded Software\nIntel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.
Intel® Turbo Boost Technology:Higher Performance When You Need It Most\nIntel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
2.0
Technical details
Intel Turbo Boost Max Technology frequency:
4500 MHz
Processor brand name:
Intel Core i7 X-series
Intel Core i7 X-series processor
Product family:
Intel Core Processors
Target market:
Gaming, Content Creation
Product type:The sub-category of the product.
Processor
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM
