Quick Code: Q MPN: AX5U5200C3816GDCLABK
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Overview



A New Speed ??Benchmark in Gaming Memory
The XPG LANCER ushers in the DDR5 era for gaming memory. Reaching frequencies of up to 6000 MT's, It will give you a major pefromance boost for gaming and overclocking.

Enhanced Power Management
The XPG LANCER DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.

Stability and Reliability
With On-die error correcting code (ECC) this module can correct errors in real-time to provide increased stability and reliability.

Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.

Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.




Specification


Technical Description:

Features
Certification:
RoHS
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Intel Extreme Memory Profile (XMP) version:
3.0
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.25 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
38
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Yes
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
5200 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR5
Memory layout (modules x size):
1 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
16 GB

General
Type:Characteristics of the device.
Memory RAM

Logistics data
Products per master (outer) case:
200 pc(s)
Master (outer) case net weight:
18.9 kg
Master (outer) case gross weight:
19.9 kg
Master (outer) case height:
285 mm
Master (outer) case length:
375 mm
Master (outer) case width:
315 mm

Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-20 - 65 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C

Packaging data
Package type:The type of product package e.g. box.
Box
Package weight:Weight of the packaged product.
188.92 g
Package height:The distance from the top to the bottom of the packaging.
15.5 mm
Package depth:The distance from the front to the back of the packaging.
150 mm
Package width:The distance from one side of the packaging to the other.
122 mm

Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
47 g
Height:The measurement of the product from head to foot or from base to top.
8 mm
Depth:The distance from the front to the back of something.
133.3 mm
Width:The measurement or extent of something from side to side.
40 mm


Product details


AX5U5200C3816GDCLABK Adata

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