Overview



Nano-Diamond Particles for Superior Heat Transmission
Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.

Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.

Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.




At-a-glance



  • Conveniently included wipes and spreader

  • Designed with hybrid silicone and nano-diamond particles for ultra-performance

  • Non-curing and non-electrically conductive properties




Reasons to buy


  • Conveniently included wipes and spreader
  • Designed with hybrid silicone and nano-diamond particles for ultra-performance
  • Non-curing and non-electrically conductive properties

Specification


Technical Description: Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

Features
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
-50 - 250 °C
Specific gravity:
2.6 g/cm³
Thermal resistance:
0.04 °C/W
Viscosity note:
6000000
Product colour:
Grey
Thermal conductivity:Thermal conductivity is the property of a material to conduct heat.
5.2 W/m·K
Type:Characteristics of the device.
Thermal paste

Packaging data
Quantity per pack:The amount in each pack.
1 pc(s)

Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
5 g


Product details


AK-T565-5G Akasa 4710679550817

Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

£18.43 and In stock

SKUAK-T565-5G

Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

Quick Code: Q553984 MPN: AK-T565-5G
£18.43

Quantity:
In Stock