Back panel I/O ports
Digital audio optical out:The socket in the device for the digital audio output. The signal is carried via an optical cable with an TOSLINK connector.
1
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Microphone in:The socket where a microphone is connected to the device.
Headphone outputs:Number of sockets /ports where headphones are connected.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
8
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
BIOS
System Management BIOS (SMBIOS) version:
3.2
BIOS memory size:
256 Mbit
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
UEFI AMI
Expansion slots
Number of M.2 (M) slots:
2
PCI Express x16 (Gen 3.x) slots:Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.
3
Features
Windows operating systems supported:Windows vesions wich can be used with the device.
Windows 10 Education x64, Windows 10 Enterprise x64, Windows 10 Home x64, Windows 10 Pro x64, Windows 10 x64
Cooling type:The method used to cool the device or to cool the air around the device.
Passive
Power source type:What the power source is.
ATX
Audio output channels:An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.
7.1 channels
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
AMD X570
Motherboard chipset family:The category of motherboard chipset e.g. Intel, AMD.
AMD
Motherboard form factor:Design of the motherboard (ATX, BTX etc).
ATX
Component for:What this product is used as a part of (component for).
PC
Graphics
Parallel processing technology support:Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs.
2-Way CrossFireX, 3-Way CrossFireX, 3-Way SLI
Internal I/O
Number of chassis fan connectors:
3
Number of EATX power connectors:
2
ATX Power connector (24-pin):
Front panel audio connector:
Number of SATA III connectors:Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.
8
USB 3.2 Gen 1 (3.1 Gen 1) connectors:
1
USB 2.0 connectors:The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.
2
Logistics data
Harmonized System (HS) code:
84733020
Memory
Maximum internal memory:The maximum internal memory which is available in the product.
128 GB
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels:
Dual-channel
Memory slots type:A memory slot, also known as a memory socket or RAM slot, is what allows computer memory (RAM) to be inserted into the computer. Depending on the motherboard, there will usually be 2 to 4 memory slots (sometimes more on high-end motherboards). The most common types of RAM are SDRAM and DDR for desktop computers and SODIMM for laptop computers, each having various types and speeds.
DIMM
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM
Network
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.0
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11ad, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
LAN controller:
Intel® I211-AT
Ethernet interface type:
2.5 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Networking
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.0
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11ad, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
LAN controller:
Intel® I211-AT
Ethernet interface type:
2.5 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Other features
Quick installation guide:
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
2 kg
Packaging content
Processor
Supported processor sockets:The sockets (plugs) for processors that are supported (can be used) by the device.
Socket AM4
Maximum number of SMP processors:
1
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
2nd Generation AMD Ryzen™ 3, 3rd Generation AMD Ryzen™ 3, 2nd Generation AMD Ryzen™ 5, 3rd Generation AMD Ryzen 5, 2nd Generation AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 9
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
Socket AM4
Processor manufacturer:The manufacturer that produced the processor.
AMD
Rear panel I/O ports
Digital audio optical out:The socket in the device for the digital audio output. The signal is carried via an optical cable with an TOSLINK connector.
1
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Microphone in:The socket where a microphone is connected to the device.
Headphone outputs:Number of sockets /ports where headphones are connected.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
8
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
Storage controllers
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 10
Supported storage drive interfaces:
M.2, PCI Express, PCI Express 2.0, PCI Express 3.0, SATA, SATA II, SATA III
Supported storage drive types:
HDD & SSD
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
108 mm
Depth:The distance from the front to the back of something.
244 mm
Width:The measurement or extent of something from side to side.
205 mm
