Features
Mac operating systems supported:Mac operating systems e.g. OS X can be used with the device.
Windows operating systems supported:Windows vesions wich can be used with the device.
Module configuration:
1024M x 8
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2666 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
19
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
260-pin SO-DIMM
Component for:What this product is used as a part of (component for).
Laptop
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
16 GB
General
Type:Characteristics of the device.
Memory RAM
Logistics data
Harmonized System (HS) code:
84733020
Packaging data
Package type:The type of product package e.g. box.
Blister
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
30 mm
Width:The measurement or extent of something from side to side.
67.6 mm
