Features
Programming power voltage (VPP):
1.8 V
Intel Extreme Memory Profile (XMP) version:
3.0
Intel Extreme Memory Profile (XMP):
Refresh row cycle time:
295 ns
Module configuration:
2048M x 64
Memory voltage:The voltage (V) of the memory in the device.
1.1 V
Memory data transfer rate:
4800 MT/s
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
38
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
262-pin SO-DIMM
Component for:What this product is used as a part of (component for).
Laptop
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Buffered memory type:
Unregistered (unbuffered)
General
Type:Characteristics of the device.
Memory RAM
Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
30 mm
Width:The measurement or extent of something from side to side.
69.6 mm
