HP BLc7000 Platinum Configure-to-order Enclosure with ROHS Trial IC Lic

The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.

The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase, 3-Phase AC input, and -48V DC input.