Features
Electrostatic Discharge (ESD) protection (contact):
8 kV
Electrostatic Discharge (ESD) protection (air):
15 kV
Data transfer rate:Rate at which data can be transferred, usually measured in units per second. May vary with network configurations.
10000 Mbit/s
Logistics data
Products per master (outer) case:
14 pc(s)
Master (outer) case height:
313 mm
Master (outer) case length:
390 mm
Master (outer) case width:
515 mm
Operational conditions
Operating relative humidity (H-H):
5 - 95%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-20 - 85 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 55 °C
Other features
Chipset:Set of electronic components in an integrated circuit that manages the data flow between the processor, memory and peripherals. It is usually found in the motherboard of a computer. Chipsets are usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance.
VIA/VLI VL822
Packaging content
Cables included:
USB Type-A to USB Type-C, USB Type-C to USB Type-C
Quick start guide:Instructions, either online, as a computer program or in paper form, to allow you to set up and start using the product quickly.
Included power plug types:
ANZ, EU, JP, NA, UK
Packaging data
Package weight:Weight of the packaged product.
1.4 kg
Package height:The distance from the top to the bottom of the packaging.
70 mm
Package depth:The distance from the front to the back of the packaging.
187 mm
Package width:The distance from one side of the packaging to the other.
290 mm
Performance
Mean time between failures (MTBF):Statistical model used to indicate product/mechanism reliability; expressed in hours and percentage of duty cycle. This number (in hours) does not indicate the mean time before failure for a single unit/mechanism.
163021.7 h
Ports & interfaces
DC-in jack:The socket/plug where the DC electricity supply connects to the device.
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
5
Hub interfaces:A hub is a device for connecting multiple devices together. The hub interface is where the hub connects to other devices via input/output (I/O) ports.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A, USB 3.2 Gen 2 (3.1 Gen 2) Type-C
Host interface:Interface that enables a host controller to communicate with a driver.
USB 3.2 Gen 2 (3.1 Gen 2) Type-C
Ports quantity:The number of ports or external interfaces to which other equipment can be connected.
7
Power
Input voltage:The voltage (V) which is required to power the product.
100 - 240 V
Power supply type:The type of power supply which this product uses.
DC
Technical details
Compliance certificates:
CE, Federal Communications Commission (FCC), RoHS, Trade Agreements Act (TAA)
Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
300 g
Height:The measurement of the product from head to foot or from base to top.
178 mm
Depth:The distance from the front to the back of something.
60 mm
Width:The measurement or extent of something from side to side.
26 mm
