Features
Embedded options available:
PCI Express slots version:
3.0
Maximum number of PCI Express lanes:
48
Graphics
Memory
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels:
Hexa-channel
Memory clock speeds supported by processor:
2666 MHz
Memory types supported by processor:
DDR4-SDRAM
Maximum internal memory supported by processor:
768 GB
Operational conditions
Other features
Compatibility:The other products, software and hardware this product can be used with.
Lenovo ThinkSystem SD530
Processor
Processor codename:
Skylake
Thermal Design Power (TDP):
125 W
Processor boost frequency:The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
3.7 GHz
Processor operating modes:Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.
64-bit
Component for:What this product is used as a part of (component for).
Server/workstation
Processor lithography:The process which is performed by the processor e.g. CPU (Central Processing Unit).
14 nm
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 3647 (Socket P)
Processor cores:The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).
16
Processor base frequency:
2.1 GHz
Processor model:The model number for the processor in a computer.
6130
Processor generation:
1st Generation Intel® Xeon® Scalable
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
Intel® Xeon®
Processor special features
Intel Turbo Boost Max Technology 3.0:
Intel Virtualization Technology (VT-x):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel® Optane™ Memory Ready:
Intel® vPro™ Platform Eligibility:
Intel Trusted Execution Technology:
Intel® AES New Instructions (Intel® AES-NI):Added Security with Faster Data Encryption\nThe Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
Intel® Hyper Threading Technology (Intel® HT Technology):Improved Performance for Threaded Software\nIntel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.
Intel® Speed Shift Technology:
Intel® Turbo Boost Technology:Higher Performance When You Need It Most\nIntel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
2.0
Weight & dimensions
Processor package size:
76 x 56.5 mm
