Quick Code: Q MPN: B760 AORUS MASTER DDR4
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Overview


Twin Digital VRM Design
To ensure maximum Turbo Boost and overclocking performance of Intel's new generation CPU, GIGABYTE AORUS series motherboard equip the best VRM design ever built with the highest quality components.

PCIe 4.0 x16 Slot
Reinforced PCIe 4.0 x16 with lower impedance.

3 x PCIe 4.0 x4 M.2 Connectors
M.2 PCIe 4.0 x4 slot with lower impedance.

Support for DDR4 XMP Up to 5333MHz and Beyond*
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.

Triple PCIe 4.0 x4 M.2 Connectors with Thermal Guard
AORUS Gaming Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their Systems' potential.

GIGABYTE PerfDrive
PerfDrive technology integrates multiple GIGABYTE exclusive BIOS settings to allow users to balance between different levels of performance, power consumption, and temperature according to their needs easily when using 13th gen Intel® Core™ processors.

GIGABYTE Motherboards' unparalleled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.

2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design.

Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

3% Cooler by implementing
2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.

Noise Detection
With the new Noise Detection function, you can monitor noise level of all devices including fans, CPU coolers, graphics card, etc. in real time, and you can determine how fast your fan speed needs to be. Our bundled Noise Detection cable doesn’t include any sound recording function, it simply detects sound pressure while protecting your privacy.

SMART FAN 6
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.

GIGABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, and Wi-Fi connectivity.

802.11ax Wi-Fi 6E
The latest Wireless solution 802.11ax Wi-Fi 6E with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

Smart Antenna
2X signal strength compared to traditional antenna design.
AORUS Antenna with smart antenna function for the best WIFI signal transmitting.

Connecting the Future - USB 3.2 Gen 2x2 Type-C®
Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works up to 20Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C® connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly.

Connecting the Future - Front USB3.2 Gen 2 Type-C®
USB 3.2 Gen 2 provides USB 3.2 Gen 2 ports with speeds up to 10Gbps. With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB 2.0 and USB 3.2 Gen1, the much improved USB 3.2 Gen 2 protocol is available over the new reversible USB Type-C™ and the traditional USB Type-A connector for better compatibility over a wider range of devices.

True High-Fidelity Music (Realtek ALC1220)
Paired with Realtek's latest ALC1220 Codec, playback for surround sound audio and DSD enabled music are easier than ever.

Audiophile Grade Capacitors (WIMA & Premium Grade Audio)
To ensure a studio-quality experience, WIMA and Premium Grade Audio capacitors are used to provide power to the overall system.

Hi-Res AudioHi-Res
Audio certified, meaning that the product is capable of reproducing frequencies up to 40kHz or above which ensures user with the best audio quality at all times.

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.

RGB Fusion Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard.
Note: Lighting effects depicted are for demonstration purposes only. Actual lighting effects may vary by model.

Multi-key
A multi-function reset button that can be reconfigured to other function in BIOS for different user scenarios.

GIGABYTE Ultra Durable™ design provides product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

EZ-Latch
With GIGABYTE EZ-Latch, you can DIY your PC in no time, quick and easy.

PCIe EZ-Latch
Unlock the latch of the PCIe slot easily when remove the graphics card in the PCIe slot.

Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don't need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on the USB flash drive, then press the dedicated Q-Flash Plus button and you’re good to go!




At-a-glance


  • Advanced Thermal Design & M.2 Thermal Guard:To Ensure VRM Power Stability & M.2 SSD Performance

  • Dual Channel DDR4:4*DIMMs with XMP Memory Module Support

  • Extended Connectivity:Front USB-C® 10Gb/s, Rear USB-C® 20Gb/s, DP, HDMI

  • EZ-Latch Plus:M.2 Connectors with Quick Release & Screwless Design

  • Fast Networks:Intel® 2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax

  • Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors

  • Next Generation Storage:3*PCIe 4.0 x4 M.2 Connectors

  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection

  • Unparalleled Performance:Twin 16*+1+1 Phases Digital VRM Solution




Reasons to buy

  • Advanced Thermal Design & M.2 Thermal Guard:To Ensure VRM Power Stability & M.2 SSD Performance
  • Dual Channel DDR4:4*DIMMs with XMP Memory Module Support
  • Extended Connectivity:Front USB-C® 10Gb/s, Rear USB-C® 20Gb/s, DP, HDMI
  • EZ-Latch Plus:M.2 Connectors with Quick Release & Screwless Design
  • Fast Networks:Intel® 2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax
  • Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
  • Next Generation Storage:3*PCIe 4.0 x4 M.2 Connectors
  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection
  • Unparalleled Performance:Twin 16*+1+1 Phases Digital VRM Solution

Specification

Technical Description:

Back panel I/O ports
USB connector type:The type of USB connector/port that this product has.
USB Type-A, USB Type-C
WiFi-AP antenna jack:
2
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Yes
Headphone outputs:Number of sockets /ports where headphones are connected.
2
Line-in:
Yes
DisplayPort version:
1.2
DisplayPorts quantity:Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.
1
HDMI version:
2.0
HDMI ports quantity:The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2x2 Type-C ports quantity:
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4

BIOS
Desktop Management Interface (DMI) version:
2.7
System Management BIOS (SMBIOS) version:
2.7
Clear CMOS jumper:
Yes
ACPI version:
5.0
BIOS memory size:
256 Mbit
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
UEFI AMI

Expansion slots
Number of M.2 (M) slots:
2
PCI Express x16 slots:
1

Features
Windows operating systems supported:Windows vesions wich can be used with the device.
Windows 10 x64, Windows 11 x64
PC health monitoring:
Fan, Temperature, Voltage, Water cooling
Audio output channels:An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.
7.1 channels
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
Intel B760 Express
Motherboard chipset family:The category of motherboard chipset e.g. Intel, AMD.
Intel
Motherboard form factor:Design of the motherboard (ATX, BTX etc).
ATX
Component for:What this product is used as a part of (component for).
PC

Graphics
HDCP:High-bandwidth Digital Content Protection (HDCP) is a form of digital copy protection to prevent copying of digital audio and video content as it travels across connections.
Yes
Maximum resolution:The maximum number of pixels that can be displayed in the image. It is usually quoted as width × height,: for example, "1024 × 768" means the width is 1024 pixels and the height is 768 pixels.
4096 x 2304 pixels
Parallel processing technology support:Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs.
Not supported

Internal I/O
RGB LED pin header:
Yes
12V power connector:
Yes
EPS power connector (8-pin):
Yes
Chassis intrusion connector:
Yes
CPU fan connector:
Yes
ATX Power connector (24-pin):
Yes
Front panel connector:
Yes
Front panel audio connector:
Yes
Audio connector:
Yes
Number of SATA III connectors:Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.
4
USB 3.2 Gen 2 (3.1 Gen 2) connectors:
1
USB 3.2 Gen 1 (3.1 Gen 1) connectors:
1
USB 2.0 connectors:The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.
2

Memory
Unbuffered memory:
Yes
Maximum internal memory:The maximum internal memory which is available in the product.
128 GB
Supported memory clock speeds:Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size.
2133,2400,2666,2933,3000,3200,3300,3333,3400,3466,3600,3666,3733,3800,3866,4000,4133,4266,4300,4400,4500,4600,4700,4800,4933,5000,5133,5333 MHz
Non-ECC:
Yes
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Yes
Memory channels:
Dual-channel
Memory slots type:A memory slot, also known as a memory socket or RAM slot, is what allows computer memory (RAM) to be inserted into the computer. Depending on the motherboard, there will usually be 2 to 4 memory slots (sometimes more on high-end motherboards). The most common types of RAM are SDRAM and DDR for desktop computers and SODIMM for laptop computers, each having various types and speeds.
DIMM
Number of memory slots:
2
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM

Network
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.3
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Yes
WLAN controller model:
Intel Wi-Fi 6E AX211
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Top Wi-Fi standard:
Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Yes
Ethernet interface type:
2.5 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Yes

Networking
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.3
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Yes
WLAN controller model:
Intel Wi-Fi 6E AX211
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Top Wi-Fi standard:
Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Yes
Ethernet interface type:
2.5 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Yes

Packaging content
Cables included:
SATA

Processor
Supported processor sockets:The sockets (plugs) for processors that are supported (can be used) by the device.
LGA 1700
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
Intel® Celeron®, Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™ i9, Intel® Pentium® Gold
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 1700
Processor manufacturer:The manufacturer that produced the processor.
Intel

Rear panel I/O ports
USB connector type:The type of USB connector/port that this product has.
USB Type-A, USB Type-C
WiFi-AP antenna jack:
2
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Yes
Headphone outputs:Number of sockets /ports where headphones are connected.
2
Line-in:
Yes
DisplayPort version:
1.2
DisplayPorts quantity:Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.
1
HDMI version:
2.0
HDMI ports quantity:The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2x2 Type-C ports quantity:
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4

Storage controllers
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 5, 10
RAID support:The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
Yes
Supported storage drive interfaces:
M.2, PCI Express 4.0, SATA III
Supported storage drive types:
HDD & SSD

Weight & dimensions
Depth:The distance from the front to the back of something.
244 mm
Width:The measurement or extent of something from side to side.
305 mm

Product details

B760 AORUS MASTER DDR4 Gigabyte

£0.00 and

SKU: B760 AORUS MASTER DDR4